Automated Machine

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WIM-120 Double-Sided Detection Printer

Product Description

To handle testing wafer by mechanism.

Avoid artificially caused by the wafer handling damaged.

To detect both sides with Dual CCD simultaneously.

To shorten the inspection time

Product features

To detect both surface simultaneously and shorten the detection time.

Defective products can be determined by RBI directly to reduce the process time.

Wafer automatic carrier.

Wafer applicable warpage 0-1500um.

Fragmentation rate ≦ 1 / 10,000.

Cassette activity holder can avoid wafer displacement.

The backside of wafer only contact invalid edge.

  Semtek Corporation

 No.536, Jianguo Rd., Yingge Dist., New Taipei City, Taiwan (R.O.C.) 

TEL/886-2-26772220   FAX/886-2-26772202

Email:marketing@semtekcorp.com