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Semiconductor Process Equipment

 

WB-2100 Wafer Bonding Machine

 

 

 

Product Description

 

 

 

The main function of wafer bonding machine is used two heterogeneous wafer with low pressure and temperature process to bind it together. The epitaxial layer is transferred to high energy gap of the substrate. After the replacement of LED substrate, it can increase availability of reflection and get better luminous efficiency.

 

 

 

 

SEMTEK multi-stage pressurization system provides a highly stable and accurate output pressure of the horizontal pressure mechanism. It can prevent uneven pressure caused by the junction gap. The precision pressing temperature control technology allows for bonding of metals closely. It also can  increase high quality on wafer bonding process.

 

Product features

 

 

The multi-stage pressure can provides a precise step-up curve and avoid

the wafer being damaged. It also can yield high quality.

Pressure is applied by a precise servo screw thread system(MAX:8000kgs).

 

Vacuum chamber materials are constructed with SUS304, pressure can be smaller than 1 torr(within 5 minutes).

 

Equipped with pollution-free and oil-less vacuum pump, and air-cooled oil-free Scroll Dry Pump.

 

Provide 20 sets of process memory formula can be memorized to set up temperature pressure curves, and storage recall funcations.

 

Real-time curve function enable to oversee the internal pressure, temperature and duration at any time.

 

PLC controls the bonding machine more stable , operate easier via HMI (Human Machine Interface).

 

 

 
 

 

  Semtek Corporation

 No.536, Jianguo Rd., Yingge Dist., New Taipei City, Taiwan (R.O.C.) 

TEL/886-2-26772220   FAX/886-2-26772202

Email:marketing@semtekcorp.com