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Current page 》 Semiconductor Process Equipment
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Semiconductor Process Equipment
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WB-2100 Wafer Bonding Machine
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Product Description
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The main function of wafer bonding machine is used two heterogeneous wafer with low pressure and temperature process to bind it together. The epitaxial layer is
transferred to high energy gap of the substrate. After the replacement of LED substrate, it can increase availability of reflection and get better luminous efficiency.
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SEMTEK multi-stage pressurization system provides a highly
stable and accurate output pressure of the horizontal pressure mechanism. It can prevent uneven pressure caused by the
junction gap. The precision pressing temperature control technology allows for bonding of metals closely.
It also can increase high quality on wafer
bonding process.
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Product features
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The multi-stage pressure can provides a precise step-up curve and
avoid
the
wafer being damaged. It also can yield high quality.
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Pressure is applied by a precise servo screw
thread system(MAX:8000kgs).
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Vacuum chamber materials are constructed with
SUS304, pressure can be smaller than 1 torr(within 5 minutes).
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Equipped with pollution-free and oil-less vacuum
pump, and air-cooled oil-free Scroll Dry Pump.
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Provide 20 sets of process memory formula can be memorized to set up temperature pressure curves,
and storage recall funcations.
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Real-time curve function enable to oversee the internal pressure, temperature and duration at any time.
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PLC controls the bonding machine more stable , operate easier via HMI (Human Machine Interface).
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Semtek Corporation
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No.536, Jianguo Rd., Yingge Dist., New Taipei City, Taiwan (R.O.C.)
TEL/886-2-26772220 FAX/886-2-26772202
Email:marketing@semtekcorp.com
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